Semiconductor device, method of manufacturing thereof, and method of manufacturing base material

ABSTRACT

It is an object of the invention to provide a lightweight semiconductor device having a highly reliable sealing structure which can prevent ingress of impurities such as moisture that deteriorate element characteristics, and a method of manufacturing thereof. A protective film having superior gas barrier properties (which is a protective film that is likely to damage an element if the protective film is formed on the element directly) is previously formed on a heat-resistant substrate other than a substrate with the element formed thereon. The protective film is peeled off from the heat-resistant substrate, and transferred over the substrate with the element formed thereon so as to seal the element.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device having a circuitthat is formed of a thin film transistor (hereinafter referred to as aTFT), and a method of manufacturing thereof. Specifically, the presentinvention relates to an electronic appliance mounted with anelectro-optic device or a light emitting display device having anorganic light-emitting element typified by a liquid crystal displaypanel as a component.

It should be note that the term “a semiconductor device” indicates allkinds of devices that can behave by utilizing semiconductorcharacteristics, and includes all of an electro-optic device, asemiconductor circuit, and an electronic appliance.

Further, the present invention relates to a method of manufacturing abase material including a protective film, which is superior in barrierproperties.

2. Description of the Related Art

In recent years, a technique for forming a thin film transistor (a TFT)by using a semiconductor thin film (with a thickness of about fromseveral nm to several hundreds nm) that is formed over a substratehaving an insulated surface has been attracting attention. The thin filmtransistor has been widely applied in electronic devices such as an ICand an electro-optic device. In particular, development related to thethin film transistor as a switching element of an image display devicehas been hurried.

Various applications utilizing such a image display device have beenexpected, and particularly, application to a portable device has beenattracting much attention. As a substrate for forming the TFTs, a glasssubstrate and a quartz substrate has been widely used now, however,these substrates have some drawbacks of being fragile and heavy.Further, these substrates are unsuitable for mass-production since thesurface area thereof is difficulty enlarged. Therefore it has beenattempted that an element including TFTs is formed over a substratehaving flexibility as typified by a flexible plastic film.

In the case of using the flexible plastic substrate, however, themaximum temperature of the process should be lowered since the plasticfilm has low heat resistance. Therefore, it has been impossible to forma TFT having as good characteristics as that formed over a glasssubstrate. Thus, a high-performance liquid crystal display device orlight emitting element using a plastic film has not been realized yet.

Further, the plastic film has a drawback of poor barrier properties.Even when a protective film having good barrier properties is providedin order to compensate the drawback, since the plastic film has low heatresistance, it is necessary to reduce the maximum temperature of a filmformation process. Therefore, a favorable protective film cannot beobtained. Accordingly, a highly reliable electronic device using theplastic film has not been realized yet.

Particularly, since an EL display device (panel) using an EL element issensitive to moisture, it is assumed that far superior gas barrierproperties are required.

With respect to the EL display device (panel) using an EL element,moisture penetrating into the device causes a serious deterioration inthe reliability of the EL display device, which further causes darkspots, shrinkage, and deterioration in luminance from the periphery of alight emitting display device. The dark spots are phenomena in which theluminance is partially decreased (including a phenomenon of non-lightemission), and caused in the case where a hole is formed in an upperelectrode. The shrinkage is a phenomenon in which the luminance isdeteriorated from edge of pixels.

Consequently, development related to a display device having a structurefor preventing the above-mentioned deteriorations in the EL element hasbeen carried out. For example, there is a technique for preventing thedeterioration of the EL element as follows (for example, see patentdocument 1): an EL element is encapsulated in an airtight container soas to protect the EL element from outside air, and a desiccant isprovided apart from the EL element in the airtight space.

Further, there is another method for preventing the deterioration of theEL element as follows (for example, see patent document 2): a sealingmaterial is formed on an insulator with an EL element formed thereon, anairtight space surrounded by a cover member and the sealing material isfilled with a filler that is composed of resin and the like so that theEL element is shielded from the outside air.

Furthermore, the patent document 3 discloses a structure in which anelectrode over a luminescent layer is coated with a water-sheddingprotective film, and a plate such as glass is attached firmly thereon.

Also, the patent document 4 discloses a structure in which a lightcurable resin is applied over an EL element and cured by beingirradiated with light to seal a two-layered film, thereby protecting theEL element mechanically.

-   -   Patent document 1: Japanese Patent Application Laid-Open No. Hei        9-148066    -   Patent document 2: Japanese Patent Application Laid-Open No. Hei        13-203076    -   Patent document 3: Japanese Patent Application Laid-Open No. Hei        10-106746    -   Patent Document 4: Japanese Patent No. 2793048

When the film thickness of a passivation film made from an inorganicinsulating film is increased in order to prevent intrusion of impuritiesinto a semiconductor element, e.g., intrusion of moisture and the likeinto an EL element, stress thereof is also increased, and hence,cracking is easily caused.

In the case where a protective film is formed over an entire surface ofa substrate with elements formed thereon by PCVD or application, anexternal extraction terminal portion is also covered with the protectivefilm. Therefore, it has been necessary that the substrate be selectivelyetched to expose the external extraction terminal portion. Meanwhile, inthe case of using the sputtering technique, although the protective filmcan be selectively formed with use of a metal mask, there is a risk ofdamaging the elements formed over the substrate due to the sputtering.

Moreover, when a glass substrate is used as a sealing substrate andadhered to a substrate with elements formed thereon to encapsulate theelements, there have been drawbacks of being easily broken and heavy.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a semiconductordevice having a highly reliable sealing structure, which is lightweightand prevents impurities such as moisture causing deterioration incharacteristics of elements, and a method of manufacturing thereof.

It is another object of the invention to provide a method ofmanufacturing a base material having a protective film which is superiorin barrier properties, besides an electronic appliance.

One feature of the invention is that a protective film having high gasbarrier properties is formed over a heat-resistant substrate in advancethat is different of a substrate with elements formed thereon, and onlythe protective film is peeled off and transferred over the substratewith the elements formed thereon. As an adhesive material fortransferring the protective film, various kinds of adhesive materialssuch as a reactive curing adhesive material, a heat curing adhesivematerial, a light curing adhesive material, and an anaerobic curingadhesive material can be cited. These adhesive materials may be formedof, for example, epoxy, acrylate, silicon, and the like.

In accordance with the invention, since the protective film ispreviously formed, the protective film may be simply separated from thesubstrate and transferred over the other substrate with elements formedthereon as a sealing treatment, which allows the elements to be sealedat short times. On the other hand, the ingress of moisture hasconventionally been necessary to be prevented during the formation ofthe protective film on the elements, and therefore, it has beendifficult to encapsulate the elements at short times.

Alternatively, the elements may be encapsulated as follows: a protectivefilm having excellent gas barrier properties is previously formed over aheat-resistant substrate that is different of a substrate with theelements formed thereon, only the protective film is transferred over aplastic substrate, and then the plastic substrate as a sealing film isattached to the substrate with the elements formed thereon.

The present invention is effective in the case where the elements mightbe damaged by the protective film having excellent gas barrierproperties if the protective film is directly formed on the elements.For example, the protective film having superior gas barrier propertiesis preferably formed of a thermal curable organic resin film, a lightcurable organic resin film, a film obtained by applying and baking asolution containing polysilazane or siloxane polymer.

When a solution containing polysilazane is directly applied on theelements formed over a substrate and baked, the solution is necessary tobe baked at temperatures of from 120° C. to 450° C., preferably from250° C. to 400° C. Therefore, the elements and substrate must withstandthe baking temperatures. Further, degasification of hydrogen, ammonium,and the like is caused upon baking the solution containing polysilazane.Similarly, there is fear that the degasification of various materials iscaused at the time of baking the organic resin films, and thedegasification thereof adversely affects the elements. Conventionally,it has been difficult to reduce a dew point since spin coating isperformed under atmospheric pressure. Particularly, a light emittingelement having a layer containing an organic compound as a lightemitting layer is easily damaged by moisture, ultraviolet light,degasification, and heat. Accordingly, the protective film has beendifficultly formed on the light emitting element, directly.

In addition, since a spin coating treatment and baking treatment arenecessary for the application, there is fear that moisture is penetratedinto the light emitting element during steps for performing thesetreatments. According to the invention, however, the protective film isnot formed on the elements directly, but the protective film, which isformed over the heat-resistant substrate by application in advance, issimply transferred on the light emitting element formed over the plasticsubstrate. Therefore, moisture does not penetrate into the elements dueto the application step.

As the other examples of the protective film having superior gas barrierproperties, the following protective films are preferably used: denseinorganic insulating films formed by PCVD (such as a SiN film and a SiNOfilm); dense inorganic insulating films formed by sputtering (such as aSiN film and a SiNO film); thin films containing carbon as its principalconstituent (such as a DLC film, a CN film, and an amorphous carbonfilm); metal oxide films (such as WO₂, CaF₂, Al₂O₃); and the like.

A diamond like carbon film (also referred to as a DLC film) can beformed by plasma CVD (typically, RF plasma CVD, microwave CVD, electroncyclotron resonance (ECR) CVD, hot-filament CVD); a combustion flamemethod; sputtering; ion-beam evaporation; laser evaporation; and thelike. As reactive gases used for film formation, a hydrogen gas and ahydrocarbon gas (e.g., CH₄, C₂H₂, C₆H₆, and the like) are used. Thereactive gases are ionized by glow discharge, and resultant ions areaccelerated and impacted to a cathode which is negatively self-biased toform a film. The CN film may be formed by using C₂H₄ gas and N₂ gas asthe reactive gases. The DLC film and the CN film are insulating filmsthat are transparent or translucent to visible light, though thetransparency and translucency thereof depend on their film thicknesses.The insulating film which transparent to visible light means that thefilm has 80 to 100% transmittance of visible light, whereas theinsulating film which translucent to visible light means that the filmhas 50 to 80% transmittance of visible light.

Since the protective film may not be formed on the elements directly inthe invention, conditions for forming the protective film are notlimited, thereby obtaining a dense film by using high-density plasma.

Conventionally, there has been a problem in which stress cracking iseasily caused if the thickness of the protective film is increased.

According to the invention, a protective film is composed of alamination film (which has a lamination structure of an inorganicinsulating film, an organic resin film, and an inorganic insulatingfilm, or a lamination structure having three or more layers) using anorganic resin film as a stress relaxation film so as to prevent filmcracking. Consequently, the total thickness of the protective film canbe increased.

Further, according to the invention, the protective film can be partlytransferred to encapsulate an element while exposing a terminal portion.Also, a laminated protective film can be transferred according to theinvention. Conventionally, in the case of directly forming a protectivefilm over an entire surface of a substrate by application to encapsulatean element, the terminal portion has been likely to be covered with theprotective film, the surface properties of an electrode for the terminalportion has been likely to be changed due to plasma, or an elementformed over the substrate has been likely to be damaged by plasma.

In addition, the present invention is effective in the case of forming atop-emission type light emitting device that is emphasized in the lighttransmitting properties of the protective film. The top emission typelight emitting device can be formed by being attached only with aprotective film having superior gas barrier properties without using atransparent substrate for sealing, which degrades the lighttransmittance slightly.

The invention can be applied to various kinds of protective films,besides the light emitting device. For example, the invention isapplicable to protective films for cards, and overcoat layers ofplastics products.

According to first aspect of the invention, there is provided a methodof manufacturing a base material. The method of manufacturing the basematerial includes the steps of: forming a layer to be peeled having aprotective film, which is formed of an inorganic insulating film, over afirst substrate; forming a material film, which is soluble in a solvent,on the layer to be peeled having the protective film; attaching a secondsubstrate on the material film with a first two-sided tape; attaching athird substrate to the bottom of the first substrate with a secondtwo-sided tape; separating the layer to be peeled having the protectivefilm from the first substrate, the second two-sided tape, and the thirdsubstrate; attaching a base material to the layer to be peeled havingthe protective film with an adhesive material; removing the secondsubstrate; removing the first two-sided tape; and removing the materialfilm by being solved with a solvent.

According to the first aspect of the invention, the base material is afilm base material. The inorganic insulating film is an SOG film.According to the above-mentioned manufacturing steps, it is possible toobtain a film substrate in that the SOG film, which is necessary to bebaked at higher temperatures than the allowable temperature limit of aplastic substrate, is fixed with an adhesive layer.

According to second aspect of the invention, there is provided a methodof manufacturing a semiconductor device. The method of manufacturing asemiconductor device includes the steps of: forming a layer to be peeledhaving a protective film, which is formed of an inorganic insulatingfilm, over a first substrate; forming a material film, which is solublein a solvent, on the layer to be peeled having the protective film;attaching a second substrate on the material film with a first two-sidedtape; attaching a third substrate to the bottom of the first substratewith a second two-sided tape; separating the layer to be peeled havingthe protective film from the first substrate, the second two-sided tape,and the third substrate; attaching a fourth substrate to the layer to bepeeled having the protective film with an adhesive material; removingthe second substrate; removing the first two-sided tape; removing thematerial film by being solved with a solvent; and attaching the fourthsubstrate with the layer to be peeled having the protective film formedthereon to a fifth substrate so as to cover a semiconductor elementformed over the fifth substrate.

The protective film can have a lamination structure. According to thirdaspect of the invention, there is provided a method of manufacturing thesemiconductor device. The method of manufacturing the semiconductordevice includes the steps of: forming a layer to be peeled having aprotective lamination film, which is formed by laminating an inorganicinsulating film and a coating film, over a first substrate; forming amaterial film, which is soluble in a solvent, on the layer to be peeledhaving the protective lamination film; attaching a second substrate onthe material film with a first two-sided tape; attaching a thirdsubstrate to the bottom of the first substrate with a second two-sidedtape; separating the layer to be peeled having the protective laminationfilm from the first substrate, the second two-sided tape, and the thirdsubstrate; attaching a fourth substrate to the layer to be peeled havingthe protective lamination film with an adhesive material; removing thesecond substrate; removing the first two-sided tape; removing thematerial film by being solved with a solvent; and attaching the fourthsubstrate with layer to be peeled having the protective lamination filmformed thereon to a fifth substrate so as to cover a semiconductorelement formed over the fifth substrate.

According to the second aspect or the third aspect of the invention, thesecond substrate and the third substrate are substrates having higherrigidity than that of the first substrate. The fourth substrate is afilm substrate. Further, the inorganic insulating film is a siliconoxide film, a silicon nitride film, or a silicon oxynitride film that isformed by PCVD, sputtering, or application. Furthermore, the coatingfilm is an organic resin film or an SOG film.

According to the second aspect or the third aspect of the invention, theprotective lamination film is composed by laminating the inorganicinsulating film, the coating film, and the inorganic insulating film. Byusing the coating film as a stress relaxation film, it is possible torealize a protective lamination film without causing stress cracking.

In addition, according to another aspect of the invention, there isprovided a semiconductor device which can be obtained according to theabove-mentioned manufacturing methods, wherein a semiconductor elementformed over a substrate is sealed with a first adhesive layer coveringthe semiconductor element and a flat protective film or a flatprotective lamination film fixed to a film substrate by a secondadhesive layer.

With respect to the above-described structure of the semiconductordevice, the structure is particularly effective in a light emittingdevice having an EL element, which is required to have superior barrierproperties. The light emitting device is applicable to both an activematrix light emitting device and a passive matrix light emitting device.

The light emitting element (EL element) includes a layer containing anorganic compound in which luminescence (electroluminescence) is obtainedby being applied with an electric field (hereinafter referred to as anEL layer); an anode; and a cathode. Luminescence in the organic compoundincludes light emission (fluorescence) in returning to a base state froman excited singlet state; and light emission (phosphorescence) inreturning to a base state from an excited triplet state. The lightemitting device manufactured according to the invention is applicable tothe case of using each light emission.

The light emitting element (EL element) having the EL layer includes astructure of sandwiching the EL layer between a pair of electrodes. TheEL layer is generally has a lamination structure. Typically, alamination structure of “a hole transporting layer, a light emittinglayer, and an electron transporting layer” can be mentioned as thelamination structure for the EL layer. This lamination structure of theEL layer exhibits extremely high light-emitting efficiency. Therefore,the lamination structure is adopted in almost of all light emittingdevices which has been researched and developed now.

Besides, a structure composed by sequentially laminating an anode, ahole injecting layer, a hole transporting layer, a light emitting layer,an electron transporting layer; or a structure composed by sequentiallylaminating an anode, a hole injecting layer, a hole transporting layer,a light emitting layer, an electron transporting layer, and an electroninjecting layer is also applicable in place of the above-mentionedstructure. The light emitting layer may be doped with fluorescentpigment and the like. Further, all of the layers may be composed ofeither low-molecular weight materials or high-molecular weightmaterials. Also, a layer containing an inorganic material may beemployed. Throughout the specification, all layers formed between thecathode and the anode are generically referred to as the EL layer.Accordingly, the EL layer includes all of the above-mentioned holeinjecting layer, hole transporting layer, light emitting layer, electrontransporting layer, and electron injecting layer.

In the light emitting device of the invention, a method of drivingscreen display is not particularly limited. For example, a dotsequential driving method, a line sequential driving method, a surfacesequential driving method, and the like may be used. A line sequentialdriving method is typically used, and a time division gray scale drivingmethod or a surface area gray scale driving method may also beappropriately employed. Further, image signals input to a source line ofthe light emitting device may be either analog signals or digitalsignals. A driver circuit and the like may be properly designedaccording to the image signals.

In light emitting devices using digital video signals, there are one inwhich video signals are input to a pixel at a constant voltage (CV), andone in which video signals are input to a pixel at a constant current(CC). The light emitting devices in which video signals are input to apixel at a constant voltage (CV) are further classified into one inwhich a constant voltage is applied to a light emitting element (CVCV),and another one in which a constant current is applied to a lightemitting element (CVCC). Also, the light emitting device in which videosignals are input to a pixel at a constant current (CC) is classifiedinto one in which a constant voltage is applied to a light emittingelement (CCCV), and another one in which a constant current is suppliedto a light emitting element (CCCC).

In the light emitting device of the invention, a protection circuit(protection diode) may be provided for the purpose of inhibitingelectrostatic discharge damage.

The invention can be applied to any light emitting devices havingvarious kinds of TFT structures, for example, a top-gate TFT, abottom-gate (inverted-stagger type) TFT, and a staggered TFT. Further,the invention is applicable to a multi-gate TFT having a plurality ofchannel formation regions such as a double-gate TFT, besides the TFThaving a single-gate.

Further, a TFT electrically connected to a light emitting element may beeither a p-channel TFT or an n-channel TFT. When the light emittingelement is electrically connected to the p-channel TFT, the p-channelTFT may be connected to an anode; a hole injecting layer, a holetransporting layer, a light emitting layer, and an electron transportinglayer may be laminated in this order on the anode; and then a cathodemay be formed thereon. Alternatively, when the light emitting element iselectrically connected to the n-channel TFT, the n-channel TFT may beconnected to a cathode; an electron transporting layer, a light emittinglayer, a hole transporting layer, and a hole injecting layer may belaminated in this order on the cathode; and then an anode may be formedthereon.

As for an active layer of a TFT, an amorphous semiconductor film, asemiconductor film including a crystalline structure, a compoundsemiconductor film including an amorphous structure, and the like can beused properly. In addition, the active layer of the TFT may be formed ofa semiamorphous semiconductor film (also referred to as amicrocrystalline semiconductor film) having an intermediate structurebetween an amorphous structure and a crystalline structure (including asingle crystal structure, and a polycrystalline structure). Thesemiamorphous semiconductor film has a third condition that is stable interms of free energy, and includes a crystalline region having shortrange order along with lattice distortion. Further, at least a part ofthe semiamorphous semiconductor film contains a crystal grain of from0.5 to 20.0 nm in size, and Raman spectrum is shifted to a lowerwavenumbers than 520 cm⁻¹. The diffraction peak of (111) and (220),which is believed to be originated in a crystalline silicon lattice, isobserved in the semiamorphous semiconductor film by X-ray diffraction.Further, the semiamorphous semiconductor film is added with hydrogen orhalogen of at least 1 atom % or more as a neutralizing agent fordangling bonds. The semiamorphous semiconductor film is formed by glowdischarge decomposition with silicide gas (by plasma CVD). As for thesilicide gas, SiH₄, Si₂H₆, SiH₂Cl₂, SiHCl₃, SiCl₄, SiF₄, and the likecan be used. The silicide gas may also be diluted with H₂, or a mixtureof H₂ and one or more rare gas elements selected from He, Ar, Kr, andNe. The dilution ratio may be in the range of from 1:2 to 1:1,000. Thepressure may be approximately in the range of from 0.1 Pa to 133 Pa. Thepower frequency is in the range of from 1 MHz to 120 MHz, preferablyfrom 13 MHz to 60 MHz. The substrate heating temperature may be set to300° C. or less, preferably from 100° C. to 250° C. With respect toimpurity elements contained in the film, each concentration ofimpurities for atmospheric constituents such as oxygen, nitrogen, andcarbon is preferably set to 1×10²⁰ cm⁻¹ or less. In particular, theoxygen concentration is set to 5×10¹⁹/cm³ or less; more preferably,1×10¹⁹/cm³ or less. The electron field-effect mobility μ of the TFTusing the semiamorphous semiconductor film as its active layer is in therange of form 1 cm²/Vsec to 10 cm²/Vsec.

According to the invention, a lightweight semiconductor device having ahighly reliable sealing structure of preventing the ingress ofimpurities such as moisture, which deteriorate the characteristics of anelement, can be realized.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings:

FIGS. 1A to 1G are cross sectional views showing steps according toEmbodiment Mode 1;

FIGS. 2A and 2B are cross sectional views showing steps according toEmbodiment Mode 2;

FIGS. 3A to 3F are cross sectional views showing steps according toEmbodiment Mode 3;

FIGS. 4A to 4D are cross sectional views showing steps according toEmbodiment Mode 4;

FIGS. 5A to 5D are cross sectional views explaining Embodiment 1 throughEmbodiment 4;

FIGS. 6A and 6B are cross sectional views explaining Embodiment 5;

FIGS. 7A to 7C are diagrams showing examples of electronic appliances;and

FIG. 8 is a diagram showing an example of an electronic appliance.

DETAILED DESCRIPTION OF THE INVENTION

Embodiment modes of the present invention will hereinafter be described.

Embodiment Mode 1

In Embodiment Mode 1, a peeling technique using a metal film and asilicon oxide film as disclosed in Japanese Patent Application Laid-OpenNo. 2003-174153 is employed. According to the peeling and transferringtechnique disclosed in Japanese Patent Application Laid-Open No.2003-174153, a metal layer is formed over a substrate, and a metal oxidelayer is formed in an interface between the metal layer and an oxidelayer when laminating the oxide layer on the metal layer. By utilizingthe metal oxide layer, peeling is performed in a subsequent step.

Concretely, a tungsten film is formed over a glass substrate bysputtering and then a silicon oxide film is laminated thereon bysputtering. When forming the silicon oxide film by sputtering, anamorphous tungsten oxide layer is formed. Elements such as a TFT areformed on the silicon oxide film. The substrate is subjected to a heattreatment of 400° C. or more in the element formation process such thatthe tungsten oxide layer is crystallized. When physical force is appliedto the resultant substrate, peeling is caused inside of or at aninterface of the tungsten oxide layer. Thus, the peeled layer (includingthe elements such as the TFT) thus obtained is transferred over aplastic substrate.

In the embodiment mode, only a protective film having superior barrierproperties is transferred over the plastic substrate as a layer to bepeeled.

A metal film 11, which is a tungsten film (with a thickness of from 10to 200 nm, preferably, from 30 to 75 nm) here, is formed on aheat-resistant substrate 10 by sputtering. An oxide film 12, which is asilicon oxide film (with a thickness of from 150 to 200 nm) here, islaminated thereon without being exposed to atmospheric air. It ispreferable that the thickness of the oxide film 12 be more than twice aslarge as that of the metal film. Although not illustrated in FIGS. 1A to1G, an amorphous metal oxide film (which is a tungsten oxide film) witha thickness of about from 2 to 5 nm is formed between the metal film 11and the silicon oxide film 12 upon lamination. When peeling is performedin the subsequent step, separation is caused inside the tungsten oxidefilm, or in an interface between the tungsten oxide film and the siliconoxide film, or in an interface between the tungsten oxide film and thetungsten film.

Since the films are also formed on the edge faces of the substrate bysputtering, and therefore, preferably removed by O₂ ashing and the like,selectively.

Subsequently, a layer 13 to be peeled is made from an SOG film on theoxide layer 12 by application (FIG. 1A, this figure shows a state afterforming the layer to be peeled). The layer 13 to be peeled is notparticularly limited as long as a layer functions as a protective film.For example, an inorganic insulating film formed by PCVD or sputtering(such as a silicon oxide film, a silicon nitride film, a siliconoxynitride film, a thin film containing carbon as its main constituent(e.g., a DLC film, a CN film, an amorphous carbon film)); an SOG filmformed by application (such as a SiOx film containing alkyl group usinga siloxane coating film, and a SiOx film using a polysilazane coatingfilm); and the like can be employed.

In the embodiment mode, a solution in which polysilazane is solved in asolvent is applied by spin coating, and then baked to form a SiOx film.As for the solvent, xylene, dibutyl ether, and cyclohexane can be used.When a solution containing polysilazane is applied and baked to form thelayer 13 to be peeled, the substrate applied with the solutioncontaining polysilazane is necessary to be baked at a temperature offrom 120° C. to 450° C., preferably from 250° C. to 400° C. Therefor,the heat-resistant substrate 10 must be formed of a material that canwithstand the baking temperatures. Accordingly, the solution containingpolysilazane cannot be applied over a plastic substrate and baked sincethe plastic substrate cannot withstand the high baking temperatures. Inaccordance with the invention, however, the solution containingpolysilazane is applied over the heat-resistant substrate 10 and bakedto form the SiOx film in advance, and then the SiOx film is transferredover a plastic substrate.

The film immediately after the application of the solution containingpolysilazane is an inorganic polymer composed of only a Si—H bond, a N—Hbond, and a Si—N bond. When the film is baked under an atmospherecontaining moisture, it is converted into a thin silica film. Thedensity of the thin silica film obtained by baking at a temperature of450° C. can be set to 2.1 to 2.2 g/cm³. Note that, in order to increasethe thickness of the thin silica film, the baking temperatures should beset at rather low temperatures so that the degree of shrinkage for thefilm can be reduced in the baking. As compared with a film formed by thesol-gel technique, the thin silica film formed according to theabove-mentioned steps has higher degree of shrinkage, thereby obtaininga dense film. Meanwhile, in the case of forming a silica film by usingthe sol-gel technique, since an organic group partly remains, a densefilm cannot be obtained, and limitation in the film thickness becomes aslow as 0.5 μm or less.

Alternatively, when the solution containing polysilazane is applied andbaked at a temperature of 800° C. or more under an atmosphere containingnitrogen, a SiN film can be formed.

At the time of application and baking mentioned above, the amorphousmetal oxide film is crystallized by performing a heat treatment of 410°C. or more to obtain a metal oxide film with a crystalline structure(not illustrated in the drawings). Thus, hydrogen is dispersed. At thetime of finishing the heat treatment of 410° C. or more, a relativelysmall force (e.g., human hands, gas pressure applied from a nozzle,ultrasonic waves, and the like) is applied to cause separation inside ofthe tungsten oxide film, or in an interface between the tungsten oxidefilm and the silicon oxide film, or in an interface between the tungstenoxide film and the tungsten film. Note that, when a heat treatment iscarried out at high temperatures of enabling to crystallize the metaloxide film, the thickness of the metal oxide film is slightly reduced.

In the case of using a tungsten film as the metal film 11, it ispreferable that the heat treatment be performed with a temperature of410° C. or more. Meanwhile, when a molybdenum film or an alloy film oftungsten and molybdenum is used as the metal film 11, however,separation can be performed without performing the heat treatment.

In order to further improve the barrier properties, a SiN film may belaminated on the thin silica film by PCVD or sputtering.

Next, a second substrate (a fixed substrate) 15 is attached to the layer13 to be peeled with a first adhesive material 14 (or a first two-sidedtape) (FIG. 1B, this figure shows a state after attaching the secondsubstrate 15). It is preferable that the second fixed substrate beattached thereto under reduced pressure so as to prevent air bubblesfrom being generated in the attached surface. The layer 13 to be peeledis formed by application and functions as a planarization film, andtherefore, it can be attached to the second substrate directly with atwo-sided tape. A material, which can be removed later (for example, anadhesive material that is soluble in water or alcohols), can be used asthe first adhesive material 14.

In order to perform the following peeling treatment easily, theadhesiveness between the metal film 11 and the oxide film 12 is partlyreduced. The treatment for partly reducing the adhesiveness is carriedout as follows: pressure or strong light is applied locally to the filmsalong the rim of the region to be separated from outside so as to partlydamage to the inside of the oxide film 12 or the interface between theoxide film and the metal film. For example, a scriber device, a laserirradiation device, and the like are used.

Thereafter, the first substrate 10 with the metal film 11 formed thereonis peeled off by using a physical means (FIG. 1C, this figure showspeeling process of the first substrate 10). They can be separated with arelatively small force (e.g., human hands, gas pressure applied from anozzle, ultrasonic waves, and the like).

Note that the second fixed substrate may be attached to the bottom ofthe first substrate 10 with a second two-sided tape to prevent thesubstrate 10 from being broken due to the peeling treatment prior toseparating the fist substrate 10 with the meal film formed thereon.

Consequently, the layer to be peeled that is formed over the siliconoxide layer 12 can be separated from the first substrate 10. FIG. 1Dshows a state after being peeled off.

Subsequently, a third substrate 17 made from a plastic film is attachedto the bottom of the oxide layer 12 with a second adhesive material 16(FIG. 1E, this figure shows a state after attaching the first substrate17). It is preferable that the third substrate 17 be attached theretounder reduced pressure so as not to generate air bubbles in the attachedsurface. As the second adhesive material 16, various kinds of curingadhesive materials including a reactive curing adhesive material, a heatcuring adhesive material, a light curing adhesive material such as anultraviolet curing adhesive material, and an anaerobic curing adhesivematerial can be employed. The third substrate 17 may be formed ofsynthetic resin that is composed of polypropylene, polypropylenesulfide, polycarbonate, poly ether imide, polyphenylene sulfide,polyphenylene oxide, poly sulfone, or polyphthalamide. In addition, a HTsubstrate (manufactured by Nippon Steel chemical Co., Ltd) with a Tg(glass transition) point of 400° C. or more may be used.

Subsequently, the first adhesive material 14 (or the first two-sidedtape) and the second fixed substrate 15 are separated (FIG. 1F, thisfigure shows the peeling process of the second substrate). When thesecond fixed substrate 15 is attached to the layer 13 to be peeled withthe two-sided tape, the second fixed substrate and the two-sided tapemay be peeled off sequentially. Meanwhile, when the second fixedsubstrate 15 is attached to the layer 13 to be peeled with the adhesivematerial that is soluble in a solvent, the adhesive material may besoaked and dissolved in the solvent so as to separate the second fixedsubstrate.

According to the above-mentioned steps, a base material (that is theplastic film here) having the protective film (that is the dense silicafilm here) with the superior barrier properties can be manufactured. Thebase material having the protection film with the superior barrierproperties is applicable to various kinds of base materials in a widerange of field as well as electric appliances. Conventionally, a thinfilm has been formed only over a heat-resistant substrate and could notbe formed over a plastic film for the sake of processing. According tothe invention, however, the thin film, which is formed on theheat-resistant substrate in advance, is peeled and transferred over aplastic substrate easily, thereby providing a plastic film having theprotective film with superior barrier properties.

The base material having the protective film with superior barrierproperties of the invention can be utilized as a coating film forvarious kinds of materials. For example, the base material of theinvention is applicable to a coating film for a plastic card; a coatingfilm for a window; a coating film for a display screen; a coating filmfor a metal component; and the like.

Next, the base material having the protective film with superior barrierproperties is attached to a fourth substrate 18 with a third adhesivematerial 19 to encapsulate an element 20 formed on the fourth substrate18 (FIG. 1G this figure shows the attaching process between the thirdsubstrate and the element substrate). As the third adhesive material 19,various kinds of curing adhesive materials including a reactive curingadhesive material, a heat curing adhesive material, a light curingadhesive material such as an ultraviolet curing adhesive material, andan anaerobic curing adhesive material can be employed. Further, thethird adhesive material 19 may be added with a gap material (such asfiber and spacer) for maintaining a gap between the substrates.

The element 20 is one or any combination of various semiconductorelements (such as a thin film diode, a photoelectric conversion elementcomposed of silicon-based PIN junction, and a silicon resistanceelement); a memory; a piezoelectric element; a liquid crystal element;an electrophoresis element; an EL element; a coil; an inductor; acapacitor; and micro magnetic device.

Embodiment Mode 2

Differing from Embodiment Mode 1 that mainly explaining a single-layeredprotective film, Embodiment Mode 2 will show an example in which aprotective lamination film including a stress relaxation film therein ispeeled off and transferred with reference to FIGS. 2A and 2B. Note that,portions other than the protective lamination film are identical tothose in Embodiment Mode 1, and will not be further explained. In FIGS.2A and 2B, same portions as those in FIGS. 1A to 1G are denoted by samereference numerals.

The metal layer 11 and the oxide layer 12 are formed on the firstsubstrate 10 in the same manner as Embodiment Mode 1. An inorganicinsulating film, which becomes a first protective film 33 a, is formedon the oxide layer 12 by PCVD. A planarized insulating film (a secondprotective film) is formed thereon as a stress relaxation layer 33 b byapplication. An inorganic insulating film, which becomes a protectivefilm 33 c, is next formed on the stress relaxation layer 33 b by PCVD(FIG. 2A).

The first protective film 33 a and the third protective film 33 c aremade from any one of silicon oxide, silicon nitride, silicon oxynitride,and a thin carbon-based film (such as a DLC film, a CN film, and anamorphous carbon film), or a lamination of the above-mentionedmaterials.

The stress relaxation layer 33 b may be formed of a photosensitive ornon-photosensitive organic material (such as polyimide, acrylic,polyamide, polyimideamide, resist, and benzocyclobutene); or an SOG filmformed by application (e.g., a SiOx film containing alkyl group using asiloxane coating film, and a SiOx film using a polysilazane coatingfilm).

Conventionally, there has been a problem that stress cracking is easilycaused when the thickness of a protective film is increased. Accordingto the prevent invention, however, the protective lamination film has alamination structure in which the stress relaxation layer is sandwichedbetween the inorganic insulating films, thereby increasing the totalthickness of the protective film without causing stress cracking.

The subsequent steps can be carried out in accordance with EmbodimentMode 1. The first substrate 10 with the oxide layer formed thereon isseparated, the protective lamination film formed on the oxide layer istransferred over the third substrate 17, and then the resultant thirdsubstrate is attached to the fourth substrate 18 with the element 20formed thereon so as to encapsulate the element (FIG. 2B).

As set forth above, the element 20 can be sealed with the protectivelamination film 33 having thick thickness in total.

The embodiment mode can be freely combined with Embodiment Mode 1.

Embodiment Mode 3

Differing from Embodiment Mode 1 showing an example in which aprotective film is transferred over a film substrate and an element issealed with the film substrate, Embodiment Mode 2 will show an examplein which only a protective film is peeled off and transferred over asubstrate with an element formed thereon to seal the element referringto FIGS. 3A to 3F. Note that, steps until forming the protective filmare identical to those in Embodiment Mode 1, and will not be furtherexplained. In FIGS. 3A to 3F, same portions as those in FIGS. 1A to 1Gare denoted by same reference numerals.

The metal layer 11, the oxide layer 12, and the layer 13 to be peeledare sequentially formed on the first substrate 10 in the same manner asEmbodiment Mode 1 (FIG. 3A, this figure shows a state after forming thelayer to be peeled).

A protective layer made from an adhesive material that can be soluble inwater or alcohols, that is, a water-soluble adhesive material 44 isapplied on an entire surface of the layer 13 to be peeled and thenbaked.

One bonding surface of a two-sided tape 45 is adhered to thewater-soluble adhesive material 44. It is preferable that the two-sidedtape 45 be bonded thereto under reduced pressure so as not to generateair bubbles in the attached surface. At this moment, a protection sheetcovered on another bonding surface of the two-sided tape 45 is notpeeled off. Another bonding surface of the two-sided tape 45 can beexposed by peeling the protection sheet in the subsequent step.

Next, the adhesiveness between the metal film 11 and the oxide film 12are partly reduced to carry out a peeling treatment easily in thesubsequent step.

Subsequently, the protection sheet provided on another surface of thetwo-sided tape 45 is peeled off and attached with a second substrate (afixed substrate) 46 (FIG. 3B). Similarly, it is preferable that thesecond substrate 46 be attached thereto under reduced pressure so as notto generate air bubbles in the attached surface.

The first substrate 10 with the metal film 11 formed thereon isseparated by using a physical means (FIG. 3C, this figure shows apeeling process of the first substrate 10). The first substrate with themetal film can be separated with a relatively small force (e.g., humanhands, gas pressure applied from a nozzle, ultrasonic waves, and thelike).

Note that the second fixed substrate 46 may be attached to the bottom ofthe first substrate 10 with a second two-sided tape so as to prevent thesubstrate 10 from being cracked due to the peeling treatment prior toseparating the fist substrate 10.

Consequently, the layer to be peeled that is formed on the silicon oxidelayer 12 can be separated from the first substrate 10.

Thereafter, a third substrate 48, that has been previously prepared, isattached to the bottom of the oxide layer 12 with an adhesive material47 (FIG. 3D, this figure shows a attaching process between the layer tobe peeled and the element substrate). Note that an element 49 has beenformed on the third substrate 48 in advance.

The two-sided tape 45 and the second fixed substrate 46 are separated,respectively (FIG. 3E).

Finally, the water-soluble adhesive material 44 is soaked and dissolvedin water to be removed.

According to the above-mentioned steps, the element 49 can be sealedonly with the protective layer with high yield (FIG. 3F, this figureshows a state after removing the water-soluble adhesive material).

In accordance with the above-described steps, it is possible to form adevice having no substrate for fixing the protective layer. As a result,the device thus manufactured is useful for a device that is required tohave high light transmittance in total and a device that is required tobe lightweight.

The embodiment mode can be freely combined with Embodiment Mode 1 orEmbodiment Mode 2.

Embodiment Mode 4

According to the invention, a protective film can be partly peeled offand transferred. An example thereof will be explained with reference toFIGS. 4A to 4D. FIGS. 4A to 4D shows cross sectional views of steps inwhich a protective film is partly transferred on a region other than aterminal electrode while exposing the terminal electrode.

A metal layer 51, an oxide layer 52, and a layer 53 to be peeledincluding a protective film are sequentially laminated on a firstsubstrate 50 in the same manner as Embodiment Mode 1 (FIG. 4A, thisfigure shows a state after forming the layer to be peeled).

A pretreatment for reducing the adhesiveness selectively (partly) iscarried out so as to cause separation phenomena easily. At this moment,separation of the protective film is triggered by being scribed orirradiated with laser beam so as to surround a pattern to betransferred.

In this embodiment mode, the pretreatment is carried out such that thelayer 53 to be peeled is transferred only to a region overlapped with asealing agent 58 and a first adhesive material, which are formed on asecond substrate 55 that has been prepared previously. Note that thesealing agent 58 having an enclosed pattern is formed to surround asemiconductor element 56, and the first adhesive material is filled in aspace surrounded with the sealing agent.

The first substrate 50 with the metal layer and the oxide layer formedthereon is attached to the resultant second substrate 55 (FIG. 4B, thisfigure shows a state after attaching the second substrate). A terminalelectrode 57 for connecting to an external portion is also formed on thesecond substrate 55 along with the semiconductor element 56.

Thereafter, the first substrate 50 with the metal film 51 formed thereonis peeled off by using a physical means. At this moment, a part of thelayer 53 to be peeled where is not in contact with the first adhesivematerial 54 and the sealing agent 58 is not peeled off and remains overthe first substrate 50 (FIG. 4C, this figure shows the peeling processof the first substrate). The peeling treatment can be carried out with arelatively small force (e.g., human hands, gas pressure applied from anozzle, ultrasonic waves, and the like).

As a result, the layer to be peeled can be partly transferred in aself-aligning manner while exposing the terminal electrode 57 (FIG. 4D,this figure shows a state after peeling the first substrate).

Conventionally, when a protective film is directly formed on an elementby application, a terminal electrode has been also coated with theprotective film. Therefore, it has been necessary to perform a step forremoving the protective film formed on the terminal electrodeselectively, thereby increasing the number of steps. On the other hand,according to the present invention, the protective film formed byapplication is transferred on a region other than the terminalelectrode, and hence, the steps can be reduced and simplified.

The embodiment mode can be freely combined with Embodiment Mode 1,Embodiment Mode 2, or Embodiment Mode 3.

The structures of the invention will be described in more detail in thefollowing embodiments.

Embodiment 1

An example of a top-emission type light emitting device will bedescribed with reference to FIG. 5A.

A TFT connecting to a light emitting element is formed over a substratehaving an insulated surface. In the case of the top-emission structure,interlayer insulating films, a gate insulating film, and a baseinsulating film are not necessarily made from light-transmittingmaterials. In this embodiment, SiNO films formed by PCVD, which arehighly stable material films, are used for first and third interlayerinsulating films. A SiOx film formed by application, which is a highlystable material film, is employed as a second interlayer insulatingfilm.

A fourth interlayer insulating film 211 is further formed. A SiOx filmformed by application is also used for the fourth interlayer insulatingfilm.

The fourth interlayer insulating film 211 is selectively etched to forma contact hole reaching an electrode of the TFT. Thereafter, areflective metal film (an Al—Si film with a thickness of 30 nm), amaterial film with a high work function (a TiN film with a thickness of10 nm), and a transparent conductive film (an ITSO film with a thicknessof 10 nm to 100 nm) are successively formed. These films are nextpatterned to form a reflective electrode 212 and a first electrode 213that are electrically connected to the TFT.

A partition wall 219 covering the end of the first electrode 213 isformed. The partition wall 219 can be formed of an inorganic material(such as silicon oxide, silicon nitride, and silicon oxynitride); aphotosensitive or non-photosensitive organic material (such aspolyimide, acrylic, polyamide, polyimideamide, a resist, andbenzocyclobutene); an SOG film obtained by application (for example, anSiOx film including an alkyl group); or a lamination of these films.

Subsequently, a layer 214 containing an organic compound is formed byvapor deposition or application.

In order to form the top-emission type light emitting device, a secondelectrode 215 is formed of an aluminum film with a thickness of from 1to 10 nm or an aluminum film containing minute amounts of Li. Inaddition, a transparent conductive film may be laminated thereon, ifnecessary.

A transparent protective layer 216 is formed on the second electrode 215by vapor deposition or sputtering so as to protect the second electrode.

By utilizing the technique as described in Embodiment Mode 3, an oxidelayer 203 a and a protective film 203 b made from an SOG film, which hasbeen formed on a heat-resistant substrate in advance, are peeled offfrom the heat-resistant substrate, and transferred over the transparentprotective layer 216. The oxide layer 203 a and protective film 203 bare then attached thereto with a sealing agent having an enclosedpattern and filler 217 composed of a transparent adhesive material so asto seal a light emitting element. Since the light emitting element canbe sealed with the oxide layer and the protective film in the lightemitting device thus manufactured, the light extraction efficiency canbe increased as compared with the case where the light emitting elementis sealed with a sealing substrate.

The filler 217 may be made from any light-transmitting materials.Typically, an ultraviolet curing or heat curing epoxy resin may be usedas the filler. The light transmittance in total can be increased byfilling the filler 217 between the substrates.

According to the above-mentioned steps, the top-emission type lightemitting device is completed. In the embodiment, SiOx is added to eachlayers (i.e., the interlayer insulating films, the base insulating film,the gate insulating film, and the first electrode) such that thereliability of the light emitting device is enhanced.

In addition, the light emitting element is sealed with the protectivelayer 203 b made from the dense SOG film such that the reliability ofthe light emitting device is further improved.

The embodiment can be freely combined with Embodiment Mode 1, EmbodimentMode 2, Embodiment Mode 3, or Embodiment Mode 4.

Embodiment 2

An example of a top-emission type light emitting device having adifferent structure of Embodiment 1 will be described with reference toFIG. 5B.

A TFT connecting to a light emitting element is formed over a substratehaving an insulated surface. In the case of the top-emission structure,interlayer insulating films, a gate insulating film, and a baseinsulating film are not necessarily formed of light-transmittingmaterials. In this embodiment, SiNO films formed by PCVD, which arehighly stable material films, are used for first and third interlayerinsulating films. A second interlayer insulating film is a SiOx filmformed by application, which is a highly stable material film. Theinterlayer insulating films and the gate insulating film are selectivelyetched to form a contact hole reaching an active layer of the TFT. Aconductive film (TiN/Al—Si/TiN) is formed and then etched (dry-etchedusing a mixed gas of BCl₃ and Cl₂) with use of a mask to form a sourceelectrode and a drain electrode of the TFT.

A first electrode 223 being electrically connected to the drainelectrode (or the source electrode) of the TFT is next formed. Forexample, the first electrode 223 may be formed of a material with a highwork function such as an element selected from TiN, TiSi_(x)N_(y), Ni,W, WSi_(x), WN_(x), WSi_(x)N_(y), NbN, Cr, Pt, Zn, Sn, In, and Mo; or afilm including an alloy material or a compound material that containsthese elements as its principal constituent; or a lamination film ofthese elements to have a total thickness in the range of 100 to 800 nm.

A partition wall 229 for covering a peripheral edge of the firstelectrode 223 is formed. As the partition wall 229, an SOG film formedby application (for example, a SiOx film including an alkyl group) isused. The partition wall 229 is dry-etched to have a predeterminedshape.

A layer 224 containing an organic compound is next formed by vapordeposition or application.

In order to form the top-emission type light emitting device, a secondelectrode 225 is made from an aluminum film with a thickness of from 1to 10 nm or an aluminum film containing minute amounts of Li. Note that,a transparent conductive film (such as an ITSO film) may be laminatedthereon, if necessary.

A transparent protective layer 226 is formed on the second electrode 225by vapor deposition or sputtering to protect the second electrode.

By utilizing the technique as described in Embodiment Mode 3, an oxidelayer 233 a and a protective film 233 b composed of an SOG film, whichhave been formed on a heat-resistant substrate in advance, are peeledoff from the heat-resistant substrate, and transferred over thetransparent protective layer 226. The oxide layer 233 a and protectivefilm 233 b are attached to the transparent protective layer with asealing agent having an enclosed pattern and filler 227 made from atransparent adhesive material such that a light emitting element issealed. The light emitting element is sealed with the oxide layer andprotective film in the light emitting device thus manufactured, andhence, the light extraction efficiency can be increased as compared withthe case of sealing the light emitting element with a sealing substrate.

The filler 227 may be formed of any light-transmitting materials.Typically, an ultraviolet curing or heat curing epoxy resin may be usedas the filler. The light transmittance in total can be improved byfilling the filler 227 between the pair of substrates.

According to the above-mentioned steps, the top-emission type lightemitting device is completed. In the embodiment, SiOx is added to eachlayers (i.e., the interlayer insulating films, the base insulating film,the gate insulating film, and the partition wall), thereby improving thereliability of the light emitting device.

In addition, the light emitting element is sealed with the protectivelayer 233 b composed of the dense SOG film such that the reliability ofthe light emitting device is further increased.

The embodiment can be freely combined with Embodiment Mode 1, EmbodimentMode 2, Embodiment Mode 3, or Embodiment Mode 4.

Embodiment 3

An example of a bottom-emission type light emitting device will bedescribed with reference to FIG. 5C.

A TFT connecting to a light emitting element is formed over atransparent substrate (a glass substrate with a refractive index ofabout 1.55). In the case of forming the bottom-emission structure,interlayer insulating films, a gate insulating film, and a baseinsulating film are formed of materials having high light-transmittingproperties. In the present embodiment, SiNO films formed by PCVD areused as first and third interlayer insulating films. Meanwhile, a SiOxfilm formed by application is used as a second interlayer insulatingfilm.

A first electrode 323 being electrically connected to the TFT is nextformed. The first electrode 323 is made from an ITSO film (100 nm inthickness), which is a transparent conductive film containing SiOx. TheITSO film is formed by sputtering using a target of indium tin oxidemixed with 1 to 10% silicon oxide (SiO₂) under the condition that a flowrate of Ar gas is set at 120 sccm; a flow rate Of O₂ gas, 5 sccm;pressure, 0.25 Pa; and electric power, 3.2 kW. After forming the ITSOfilm, a heat treatment is carried out at a temperature of 200° C. forone hour.

A partition wall 329 covering a peripheral edge of the first electrode323 is 1o formed. The partition wall 329 can be formed of an inorganicmaterial (such as silicon oxide, silicon nitride, and siliconoxynitride); a photosensitive or non-photosensitive organic material(such as polyimide, acrylic, polyamide, polyimideamide, a resist, andbenzocyclobutene); an SOG film (for example, an SiOx film including analkyl group) obtained by application; or a lamination of these films.

In the embodiment, the partition wall 329 is patterned by wet etchingsuch that only an upper edge portion of the partition wall has a curvedsurface with a radius of curvature. For example, it is preferable thatthe partition wall 329 be made from a positive photosensitive acrylic sothat only the upper edge portion of the partition wall has a curvedsurface with a radius of curvature. Either a negative photosensitiveacrylic that is insoluble in etchant due to irradiation of light or apositive photosensitive acrylic that is soluble in etchant due toirradiation of light can be used as the partition wall.

Subsequently, a layer 324 containing an organic compound is formed byvapor deposition and application. In the embodiment, a light emittingelement that emits green light is formed. CuPc (20 nm in thickness) andNPD (40 nm in thickness) are laminated by vapor deposition, and Alq₃doped with DMQd (37.5 nm in thickness), Alq₃ (37.5 nm in thickness), andCaF₂ (1 nm in thickness) are further laminated sequentially byco-deposition.

A second electrode 325 may be composed by laminating an alloy of MgAg,MgIn, AlLi, CaF₂, CaN, and the like, or a film formed by co-depositingaluminum and an element belonging to group 1 or 2 of the periodic table.In the embodiment, Al is vapor deposited to have a thickness of 200 nmas the second electrode. Note that, a protective film may be laminatedthereon, if necessary.

By utilizing the technique as described in Embodiment Mode 3, an oxidelayer 333 a and a protective film 333 b made from an SOG film, whichhave been formed on a heat-resistant substrate in advance, are peeledoff from the heat-resistant substrate, and transferred over a filmsubstrate 335. Then, the film substrate 335 with the protective film 333b and the oxide layer 333 a formed thereon is attached to thetransparent substrate with the light emitting element formed thereon byusing a sealing agent having an enclosed pattern and filler 327 madefrom a transparent adhesive material so that the light emitting elementis sealed.

The material for the filler 327 is not particularly limited. Typically,an ultraviolet curing or heat curing epoxy resin may be used as thefiller.

According to the above-mentioned steps, the bottom-emission type lightemitting device is completed. In the embodiment, the refractive indicesand thicknesses of each layers (i.e., the interlayer insulating films,the base insulating film, the gate insulating film, and the firstelectrode) are determined in adjustable ranges so that the reflection oflight is suppressed in each interface of the layers, thereby increasingthe light extraction efficiency.

The embodiment can be freely combined with Embodiment Mode 1, EmbodimentMode 2, Embodiment Mode 3, or Embodiment Mode 4.

Embodiment 4

An example of a dual-emission type light emitting device, which can emitlight upward and downward through both substrates, will be describedwith reference to FIG. 5D.

A TFT connecting to a light emitting element is formed over atransparent substrate (i.e., a glass substrate with a refractive indexof about 1.55). Interlayer insulating films, a gate insulating film, anda base insulating film are formed of materials having highlight-transmitting properties so as to transmit light therethrough todisplay images. In the present embodiment, SiNO films formed by PCVD areused as first and third interlayer insulating films. A SiOx film formedby application is used as a second interlayer insulating film.

A first electrode 423 being electrically connected to the TFT is nextformed. The first electrode 423 is made from an ITSO film (100 nm inthickness), which is a transparent conductive film containing SiOx.

A partition wall 429 covering a peripheral edge portion of the firstelectrode 423 is formed. The partition wall 429 can be formed of aninorganic material (such as silicon oxide, silicon nitride, and siliconoxynitride); a photosensitive or non-photosensitive organic material(such as polyimide, acrylic, polyamide, polyimideamide, a resist, andbenzocyclobutene); an SOG film obtained by application (for example, anSiOx film including an alkyl group); or a lamination of these films.

In the embodiment, the partition wall 429 is patterned by wet etchingsuch that only an upper edge portion of the partition wall has a curvedsurface with a radius of curvature.

A layer 424 containing an organic compound is formed by vapor depositionor application.

In order to emit light upwardly, a second electrode 425 is formed of analuminum film with a thickness of from 1 to 10 nm or an aluminum filmcontaining minute amounts of Li. Note that, a transparent conductivefilm may be laminated thereon, if necessary.

Subsequently, a transparent protective layer 426 is formed on the secondelectrode 425 by vapor deposition or sputtering so as to protect thesecond electrode.

By using the technique as described in Embodiment Mode 3, an oxide layer433 a and a protective film 433 b made from an SOG film, which has beenformed on a heat-resistant substrate in advance, are peeled off from theheat-resistant substrate, and transferred over the transparentprotective layer 426. Then, the oxide layer and protective film areattached to the transparent protective layer with a sealing agent havingan enclosed pattern and filler 427 composed of a transparent adhesivematerial so as to seal the light emitting element. The light emittingelement is sealed with the oxide layer and protective film in the lightemitting device thus manufactured, and therefore, the light extractionefficiency can be increased as compared with the case of sealing thelight emitting element with a sealing substrate.

The filler 427 may be made from any material having thelight-transmitting properties. Typically, an ultraviolet curing or heatcuring epoxy resin may be used as the filler. Furthermore, the lighttransmittance in total can be improved by filling the filler 427 betweenthe pair of substrates.

Furthermore, the light emitting element is sealed with the protectivelayer 433 b made from the dense SOG film, thereby improving thereliability of the light emitting device.

With respect to the dual-emission (both top and bottom emissions) lightemitting device as shown in FIG. 5D, two pieces of polarizing plates aredisposed sandwiching a light emitting panel so that a direction ofpolarization becomes perpendicular to the polarizing plates, therebypreventing a display from being hard to be recognized because oftransparency to see a background when seen from one side.

The embodiment can be freely combined with Embodiment Mode 1, EmbodimentMode 2, Embodiment Mode 3, or Embodiment Mode 4.

Embodiment 5

An example of an inverted-stagger type TFT will be described withreference to FIGS. 6A and 6B.

FIG. 6A shows a channel stopper type TFT of an n-channel type, which isformed over a substrate 710. A gate electrode 719 and a terminalelectrode 715 are simultaneously formed. A semiconductor layer 714 amade from an amorphous semiconductor film, an n+ layer 718, and a metallayer 717 are laminated on a gate insulating film 712. A channel stopper714 b is formed at an upper portion of the semiconductor layer 714a,where will be a channel formation region. Further, source electrode ordrain electrode 721 and 722 are formed.

A light emitting element connecting to the TFT utilizes a layer 724containing an organic compound as a light emitting layer.

In order to form the n-channel type TFT as shown in FIG. 6A, the TFT isconnected to a cathode 723. An electron transporting layer, a lightemitting layer, a hole transporting layer, a hole injecting layer, andan anode 725 are sequentially laminated on the cathode 723.

By using the technique as described in Embodiment Mode 4, an oxide layer735 and a protective film 734, which have been formed on aheat-resistant substrate in advance, are peeled off from theheat-resistant substrate, and transferred over the substrate 710,selectively. Then, the oxide layer and protective film are partlyattached to the substrate 710 with a sealing agent 728 having anenclosed pattern and filler 727 made from a transparent adhesivematerial so as to seal the light emitting element. The light emittingelement can be sealed with the oxide layer and protective film in thelight emitting device thus manufactured.

The material for the filler 727 is not particularly limited. Typically,an ultraviolet curing or heat curing epoxy resin may be used as thefiller.

On the other hand, FIG. 6B shows a channel etched TFT of an n-channeltype. A gate electrode 819 and a terminal electrode 815 aresimultaneously formed. A semiconductor layer 814 made from an amorphoussemiconductor film, an n+layer 818, and a metal layer 817 are laminatedon a gate insulating film 812. A part of the semiconductor layer 814where becomes a channel formation region is etched thinly. Further,source or drain electrode 821 and 822 are formed. A light emittingelement being in contact with the TFT utilizes a layer 824 containing anorganic compound as a light emitting layer.

In order to form the n-channel type TFT as shown in FIG. 6B, the TFT isconnected to a cathode 823. An electron transporting layer, a lightemitting layer, a hole transporting layer, a hole injecting layer, andan anode 825 are sequentially laminated on the cathode 823.

By utilizing the technique as described in Embodiment Mode 1, an oxidelayer 835 and a protective film 836, which have been formed on aheat-resistant substrate in advance, are peeled off from theheat-resistant substrate, and transferred over a film substrate 833. Theresultant film substrate 833 is attached to the substrate 810 with asealing agent 828 having an enclosed pattern and filler 827 composed ofa transparent adhesive material so as to seal the light emittingelement. The light emitting element can be sealed with the filmsubstrate with the oxide layer and protective film formed thereon in thelight emitting device thus manufactured.

Note that the film substrate 833 fixes the protective film 836 and theoxide layer 835 with an adhesive material 834.

The material for the filler 827 is not particularly limited. Typically,an ultraviolet curing or heat curing epoxy resin may be used as thefiller.

As substitute for the amorphous semiconductor film, it is possible touse a semiamorphous semiconductor film (also referred to as amicrocrystalline semiconductor film), which includes an intermediatestructure between an amorphous structure and a crystalline structure(including a single crystal structure and a poly crystalline structure),a third condition that is stable in terms of free energy, and acrystalline region having short-range order along with latticedistortion.

The embodiment can be freely combined with Embodiment Mode 1, EmbodimentMode 2, Embodiment Mode 3, or Embodiment Mode 4.

Embodiment 6

Various kinds of modules (such as an active matrix EL module, a passivematrix EL module, a liquid crystal display device, and an active matrixEC module) can be achieved according to the invention. That is, all theelectronic appliances incorporated with the various kinds of modules canbe completed by implementing the present invention.

Examples of the electronic appliances include a video camera; a digitalcamera; a head-mounted display (a goggle-type display); a car navigationsystem; a projector; a car stereo; a personal computer; a card; aportable information terminal (such as a mobile computer, a cellularphone, and an electronic book); and the like.

The invention is further applicable to various kinds of coating films,besides the above-mentioned electronic appliances.

Practical examples thereof are shown in FIGS. 7A to 7C and FIG. 8.

FIG. 7A is a cellular phone including a main body 2901; an audio outputportion 2902; an audio input portion 2903; a display portion 2904;operation switches 2905; an antenna 2906; an image input portion 2907(such as a CCD and an image sensor); and the like. According to theinvention, a display device can be made thinner by transferring only aprotective film having superior barrier properties, and therefore, thetotal weight of the cellular phone can be reduced.

FIG. 7B shows a card or a card-type portable information terminal,including a display portion 3011; a driver circuit portion 3013; afunctional circuit portion 3012 such as a CPU; a sealing pattern 3014; abuttery 3015; and a flexible substrate 3010. Further, a protective filmhaving superior barrier properties can be transferred over a plasticcard on which the display portion and circuits such as a functionalcircuit are not formed.

FIG. 7C is a personal laptop computer including a main body 3201; acasing 3202; a display portion 3203; a keyboard 3204; an externalconnection port 3205; a pointing mouse 3206; and the like. Bytransferring a protective film having superior barrier propertiesaccording to the invention, protection of the display portion can bereinforced.

FIG. 8 is a television including a casing 2001; a supporting base 2002;a display portion 2003; a video input terminal 2005; and the like. Bytransferring a protective film having superior barrier propertiesaccording to the invention, protection of the display portion can bereinforced. The television includes every television for displayinginformation such as one for a personal computer, for receiving TVbroadcasting, and for advertisement.

As set forth above, the semiconductor device and the base materialmanufactured according to the invention can be used for components ofvarious kinds of electronic appliances. A semiconductor devicemanufactured according to any one of Embodiment Mode 1 throughEmbodiment Mode 4, and Embodiment 1 through Embodiment 5 can be used forthe electronic appliances of the present embodiment.

According to the invention, a dense thin film, which has beenconventionally impossible to be formed on a low heat-resistancesubstrate for the sake of processing, can be peeled off easily from aheat-resistance substrate, thereby providing a protective film withsuperior barrier properties.

1. A method of manufacturing a base material, comprising the steps of:forming a layer to be peeled including a protective film, over a firstsubstrate; attaching a second substrate to the layer to be peeled with afirst adhesive material; peeling the first substrate from the layer tobe peeled; forming an element over a third substrate; attaching theelement to the layer to be peeled with a second adhesive material; andpeeling the second substrate from the layer to be peeled by removing thefirst adhesive material.
 2. The method of manufacturing the basematerial according to claim 1, wherein the element includes a lightemitting element.
 3. The method of manufacturing the base materialaccording to claim 1, wherein the element includes a semiconductorelement.
 4. The method of manufacturing the base material according toclaim 1, wherein the protective film includes at least one of aninorganic insulating film and an SOG film.
 5. The method ofmanufacturing the base material according to claim 4, wherein theinorganic insulating film comprises any one of a silicon oxide, asilicon nitride, and a silicon oxynitride formed by any one of PCVD,sputtering, and application.
 6. The method of manufacturing the basematerial according to claim 1, wherein the layer to be peeled furtherincluding a stress relaxation film.
 7. The method of manufacturing thebase material according to claim 6, wherein the stress relaxation filmis an organic resin film or an SOG film.
 8. The method of manufacturingthe base material according to claim 1, wherein the first adhesivematerial comprises a material which can be solved with a solvent
 9. Themethod of manufacturing the base material according to claim 1, whereinthe first adhesive material comprises a two-sided tape.
 10. The methodof manufacturing the base material according to claim 1, wherein thebase material is used in one selected from the group consisting of acellular phone, a card type portable information terminal, a personallaptop computer, and television.
 11. A method of manufacturing a basematerial, comprising the steps of: forming a layer to be peeledincluding a protective film, over a first substrate; attaching a secondsubstrate to the layer to be peeled with a first adhesive material;peeling the first substrate from the layer to be peeled; attaching athird substrate to the layer to be peeled with a second adhesivematerial; peeling the second substrate from the layer to be peeled byremoving the first adhesive material; forming an element over a fourthsubstrate; and attaching the element to the layer to be peeled with athird adhesive material.
 12. The method of manufacturing the basematerial according to claim 11, wherein the element includes a lightemitting element.
 13. The method of manufacturing the base materialaccording to claim 11, wherein the element includes a semiconductorelement.
 14. The method of manufacturing the base material according toclaim 11, wherein the protective film includes at least one of aninorganic insulating film and an SOG film.
 15. The method ofmanufacturing the base material according to claim 14, wherein theinorganic insulating film comprises any one of a silicon oxide, asilicon nitride, and a silicon oxynitride formed by any one of PCVD,sputtering, and application.
 16. The method of manufacturing the basematerial according to claim 11, wherein the layer to be peeled furtherincluding a stress relaxation film.
 17. The method of manufacturing thebase material according to claim 16, wherein the stress relaxation filmis an organic resin film or an SOG film.
 18. The method of manufacturingthe base material according to claim 11, wherein the third substrate isa film base material.
 19. The method of manufacturing the base materialaccording to claim 11, wherein the first adhesive material comprises amaterial which can be solved with a solvent
 20. The method ofmanufacturing the base material according to claim 11, wherein the firstadhesive material comprises a two-sided tape.
 21. The method ofmanufacturing the base material according to claim 11, wherein the basematerial is used in one selected from the group consisting of a cellularphone, a card type portable information terminal, a personal laptopcomputer, and television.
 22. A method of manufacturing a base material,comprising the steps of: forming a layer to be peeled including aprotective film, over a first substrate; forming a first element over asecond substrate; forming a second element over a second substrate;forming a sealing agent having an enclosed pattern to surround the firstelement, over substrate; attaching a adhesive material inside of thesealing agent, over the first element; attaching the layer to be peeledto the adhesive material; and peeling the first substrate from the layerto be peeled.
 23. The method of manufacturing the base materialaccording to claim 22, wherein the element includes a light emittingelement.
 24. The method of manufacturing the base material according toclaim 22, wherein the element includes a semiconductor element.
 25. Themethod of manufacturing the base material according to claim 22, whereinthe protective film includes at least one of an inorganic insulatingfilm and an SOG film.
 26. The method of manufacturing the base materialaccording to claim 25, wherein the inorganic insulating film comprisesany one of a silicon oxide, a silicon nitride, and a silicon oxynitrideformed by any one of PCVD, sputtering, and application.
 27. The methodof manufacturing the base material according to claim 22, wherein thelayer to be peeled further including a stress relaxation film.
 28. Themethod of manufacturing the base material according to claim 27, whereinthe stress relaxation film is an organic resin film or an SOG film. 29.The method of manufacturing the base material according to claim 22,wherein the first adhesive material comprises a material which can besolved with a solvent
 30. The method of manufacturing the base materialaccording to claim 22, wherein the first adhesive material comprises atwo-sided tape.
 31. The method of manufacturing the base materialaccording to claim 22, wherein the base material is used in one selectedfrom the group consisting of a cellular phone, a card type portableinformation terminal, a personal laptop computer, and television.
 32. Amethod of manufacturing a base material, comprising the steps of:forming a layer to be peeled including: a first protective film over afirst substrate, a stress relaxation film over the first protectivefilm, and a second protective film over the stress relaxation film,attaching a second substrate to the layer to be peeled with a firstadhesive material; peeling the first substrate from the layer to bepeeled; forming an element over a third substrate; attaching the elementto the layer to be peeled with a second adhesive material; and peelingthe second substrate from the layer to be peeled by removing the firstadhesive material.
 33. The method of manufacturing the base materialaccording to claim 32, wherein the element includes a light emittingelement.
 34. The method of manufacturing the base material according toclaim 32, wherein the element includes a semiconductor element.
 35. Themethod of manufacturing the base material according to claim 32, whereinany one of the first and the second protective film includes at leastone of an inorganic insulating film and an SOG film.
 36. The method ofmanufacturing the base material according to claim 35, wherein theinorganic insulating film comprises any one of a silicon oxide, asilicon nitride, and a silicon oxynitride formed by any one of PCVD,sputtering, and application.
 37. The method of manufacturing the basematerial according to claim 32, wherein the stress relaxation film is anorganic resin film or an SOG film.
 38. The method of manufacturing thebase material according to claim 32, wherein the first adhesive materialcomprises a material which can be solved with a solvent
 39. The methodof manufacturing the base material according to claim 32, wherein thefirst adhesive material comprises a two-sided tape.
 40. The method ofmanufacturing the base material according to claim 32, wherein the basematerial is used in one selected from the group consisting of a cellularphone, a card type portable information terminal, a personal laptopcomputer, and television.
 41. A method of manufacturing a base material,comprising the steps of: forming a layer to be peeled including: a firstprotective film over a first substrate, a stress relaxation film overthe first protective film, and a second protective film over the stressrelaxation film, attaching a second substrate to the layer to be peeledwith a first adhesive material; peeling the first substrate from thelayer to be peeled; attaching a third substrate to the layer to bepeeled with a second adhesive material; peeling the second substratefrom the layer to be peeled by removing the first adhesive material;forming an element over a fourth substrate; and attaching the element tothe layer to be peeled with a third adhesive material.
 42. The method ofmanufacturing the base material according to claim 41, wherein theelement includes a light emitting element.
 43. The method ofmanufacturing the base material according to claim 41, wherein theelement includes a semiconductor element.
 44. The method ofmanufacturing the base material according to claim 41, wherein any oneof the first and the second protective film includes at least one of aninorganic insulating film and an SOG film.
 45. The method ofmanufacturing the base material according to claim 44, wherein theinorganic insulating film comprises any one of a silicon oxide, asilicon nitride, and a silicon oxynitride formed by any one of PCVD,sputtering, and application.
 46. The method of manufacturing the basematerial according to claim 41, wherein the stress relaxation film is anorganic resin film or an SOG film.
 47. The method of manufacturing thebase material according to claim 41, wherein the third substrate is afilm base material.
 48. The method of manufacturing the base materialaccording to claim 41, wherein the first adhesive material comprises amaterial which can be solved with a solvent
 49. The method ofmanufacturing the base material according to claim 41, wherein the firstadhesive material comprises a two-sided tape.
 50. The method ofmanufacturing the base material according to claim 41, wherein the basematerial is used in one selected from the group consisting of a cellularphone, a card type portable information terminal, a personal laptopcomputer, and television.
 51. A method of manufacturing a base material,comprising the steps of: forming a layer to be peeled including: a firstprotective film over a first substrate, a stress relaxation film overthe first protective film, and a second protective film over the stressrelaxation film, forming a first element over a second substrate;forming a second element over a second substrate; forming a sealingagent having an enclosed pattern to surround the first element, oversubstrate; attaching a adhesive material inside of the sealing agent,over the first element; attaching the layer to be peeled to the adhesivematerial; and peeling the first substrate from the layer to be peeled.52. The method of manufacturing the base material according to claim 51,wherein the element includes a light emitting element.
 53. The method ofmanufacturing the base material according to claim 51, wherein theelement includes a semiconductor element.
 54. The method ofmanufacturing the base material according to claim 51, wherein any oneof the first and the second protective film includes at least one of aninorganic insulating film and an SOG film.
 55. The method ofmanufacturing the base material according to claim 54, wherein theinorganic insulating film comprises any one of a silicon oxide, asilicon nitride, and a silicon oxynitride formed by any one of PCVD,sputtering, and application.
 56. The method of manufacturing the basematerial according to claim 51, wherein the stress relaxation film is anorganic resin film or an SOG film.
 57. The method of manufacturing thebase material according to claim 51, wherein the first adhesive materialcomprises a material which can be solved with a solvent
 58. The methodof manufacturing the base material according to claim 51, wherein thefirst adhesive material comprises a two-sided tape.
 59. The method ofmanufacturing the base material according to claim 51, wherein the basematerial is used in one selected from the group consisting of a cellularphone, a card type portable information terminal, a personal laptopcomputer, and television.
 60. A method of manufacturing a semiconductordevice, comprising the steps of: forming a layer to be peeled includinga protective film, over a first substrate; attaching a second substrateto the layer to be peeled with a first adhesive material; peeling thefirst substrate from the layer to be peeled; forming an element over athird substrate; attaching the element to the layer to be peeled with asecond adhesive material; and peeling the second substrate from thelayer to be peeled by removing the first adhesive material.
 61. Themethod of manufacturing the semiconductor device according to claim 60,wherein the protective film includes at least one of an inorganicinsulating film and an SOG film.
 62. The method of manufacturing thesemiconductor device according to claim 61, wherein the inorganicinsulating film comprises any one of a silicon oxide, a silicon nitride,and a silicon oxynitride formed by any one of PCVD, sputtering, andapplication.
 63. The method of manufacturing the semiconductor deviceaccording to claim 60, wherein the layer to be peeled further includinga stress relaxation film.
 64. The method of manufacturing thesemiconductor device according to claim 63, wherein the stressrelaxation film is an organic resin film or an SOG film.
 65. The methodof manufacturing the semiconductor device according to claim 60, whereinthe base material is used in one selected from the group consisting of acellular phone, a card type portable information terminal, a personallaptop computer, and television.
 66. A method of manufacturing asemiconductor device, comprising the steps of: forming a layer to bepeeled including a protective film, over a first substrate; forming afirst element over a second substrate; forming a second element over asecond substrate; forming a sealing agent having an enclosed pattern tosurround the first element, over substrate; attaching a adhesivematerial inside of the sealing agent, over the first element; attachingthe layer to be peeled to the adhesive material; and peeling the firstsubstrate from the layer to be peeled.
 67. The method of manufacturingthe semiconductor device according to claim 66, wherein the protectivefilm includes at least one of an inorganic insulating film and an SOGfilm.
 68. The method of manufacturing the semiconductor device accordingto claim 67, wherein the inorganic insulating film comprises any one ofa silicon oxide, a silicon nitride, and a silicon oxynitride formed byany one of PCVD, sputtering, and application.
 69. The method ofmanufacturing the semiconductor device according to claim 66, whereinthe layer to be peeled further including a stress relaxation film. 70.The method of manufacturing the semiconductor device according to claim69, wherein the stress relaxation film is an organic resin film or anSOG film.
 71. The method of manufacturing the semiconductor deviceaccording to claim 66, wherein the base material is used in one selectedfrom the group consisting of a cellular phone, a card type portableinformation terminal, a personal laptop computer, and television.